Internia

Hardware Engineer Interview Experiences

Apple

Hardware Engineer

Winter 2026

No Offer

Purdue University · Electrical Engineering

4th year · 3.3-3.6 GPA · 2 past internships

TechnicalMultiple roundsSlow process

Six weeks of waiting and the rejection email said nothing useful. Phone screen with a team lead on circuit analysis and PCB layout. Technical round had Verilog questions plus a hardware debugging project discussion.

IBM

Hardware Engineer

Summer 2026

Accepted

Rensselaer Polytechnic Institute · Electrical Engineering

2nd year · 3.7+ GPA · 0 past internships

VirtualConversationalResume Review

Single round, mostly behavioral questions, technical questions about experiences and skills listed on resume. Interviewed directly with team and hiring manager

Intel

Hardware Engineer

Winter 2026

No Offer

Purdue University · Electrical Engineering

4th year · 3.3-3.6 GPA · 2 past internships

TechnicalDifficultVirtual

Domain stuff matters more than coding here. Phone screen, then technical on semiconductor processes and VLSI design. Got a question about propagation delay and power tradeoffs I only partially answered. Coding at the end was easier.

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